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G808P-A3
G808P-A3
T808G-A3
  • ThinkCores T808G-A3 has a high-performance two-way universal server, with the help of Intel ® The latest generation Xeon Ice Lake series processor adopts the latest 10nm manufacturing process. Its unique large capacity and high scalability design can significantly improve processing throughput and reliability at low cost. It uses efficient RAID array cards, supports multiple disk redundancy technologies, and has the functions of automatic reconstruction and dynamic sector repair, online capacity expansion, RAID level migration, etc; It provides an extremely flexible platform in terms of performance, scalability and built-in functions.
  • Green, energy-saving, economical and silent
    Efficient heat dissipation design, supports CPU intelligent frequency adjustment, fan PID intelligent speed adjustment, and dynamic output of power consumption

    Provides 80 PLUS Platinum/Titanium power modules with different energy efficiency levels, high efficiency and energy saving

    Optional cold plate liquid cooling greatly reduces noise and data center PUE
  • Flexible configuration and extreme expansion
    Supports a variety of hard disk configuration solutions, allowing you to choose independently to meet massive storage needs

    Onboard integrated network card, flexible network card expansion, and network configuration on demand

    Rich PCIe resources, easy to expand, to meet the application of different scenarios
  • Excellent performance, super computing power
    Supports Intel® 4th/5th Xeon® Scalable processors, single processor supports up to TDP 350W

    The new UPI2.0 interconnection architecture, each transmission channel can reach 16GT/s, and the computing performance is strong

    Supports up to 32 DDR5 memories, maximum frequency 5600MHz, memory bandwidth increased by 75%

    Full support for PCIe 5.0 protocol, transmission rate increased by 100%
technical specifications
G808P-A3
T808G-A3
  • Model
  • Form factor
  • Processor
  • Chipset
  • Memory
  • Storage controller
  • Storage
  • Network
  • PCIe expansion
  • I/O ports
  • Management
  • Security
  • Fan
  • Power supply
  • Operating system
  • Size
  • Environment

  • T808G-A3
  • 4U Rackmount
  • Dual 4th/5th Gen Intel Xeon Scalable Processor(Air/Liquid cooled) 350W TDP
  • IntelC741 Chipset
  • 32x DDR5 RDIMM slots,5600MHz,Upto 16TB DIMM Sizes 16GB,32GB,64GB,128GB,256GB,512GB
  • Supports HBA/RAID cards JBOD,RAID 0,1,10,5,6,50,60 When configuring RAID controllers, they can support Cache supercapacitor protection,provide RAID level migration,disk roaming, self-diagnostics,Web remote setup, etc, and support RAID card secure boot up.
  • Front: 8x 2.5"/3.5" SAS/SATA/NVMe hot-swap hard drive Internal: 2x M.2 2280/22110 SATA/PCle 3.0 x4
  • Optional1:2x1GbE BaseT LAN Optional2:2x10GbE BaseT LAN Optional various types of network adapters based on standard PCle slots
  • UP to 13x PCle 5.0 expansion slots Up to 8x FHFL, double-width GPU
  • 2xUSB 3.0,1xVGA,1xCOM
  • 1x 1GbE RJ45 dedicated IPMI LAN Onboard management chip, independent interface,support SNMP,IPMI, provide GUI, virtual KVM,virtual media, SOL, intelligent power supply, remote control, hardware monitoring and other features
  • Optional TPM security management module, lid intrusion detection
  • Hot-swap fan modules support N+1redundancy
  • Support 2+2 redundancy 2600W/3000W titanium Level power supplies
  • Microsoft Windows Server,Red Hat Enterprise Linux,SUSE Linux Enterprise Server,CentOS,VMware ESXi,Citrix XenServer,Ubuntu Linux Please consult sales staff for specific versions.
  • 440mm x174.5mmx800mm(W*H*D)
  • Operating Temperature:10C to 35°C(50F to 95°F), Operating Relative Humidity: 8% to 90% (non-condensing)
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