Supports Intel® 3rd Xeon® Scalable processor, single processor supports maximum TDP 270W
The new UPI2.0 interconnection architecture, each transmission channel can reach 16GT/s, and the computing performance is strong
Supports up to 16 DDR4 memories, maximum frequency 4800MHz, memory bandwidth increased by 75%
Full support for PCIe 4.0 protocol, transmission rate increased by 100%
Supports a variety of hard disk configuration solutions, allowing you to choose independently to meet massive storage needs
Onboard integrated network card, flexible network card expansion, and network configuration on demand
Rich PCIe resources, easy to expand, to meet the application of different scenarios
Efficient heat dissipation design, supports CPU intelligent frequency adjustment, fan PID intelligent speed adjustment, and dynamic output of power consumption
Provides 80 PLUS Platinum/Titanium power modules with different energy efficiency levels, high efficiency and energy saving
Optional cold plate liquid cooling greatly reduces noise and data center PUE